As per industry analyst Ming-Chi Kuo, NVIDIA has made changes to its "Blackwell" architecture roadmap, focusing on dual-die designs using CoWoS-L packaging technology. The updated roadmap removes several single-die products that were originally planned to use CoWoS-S packaging, altering NVIDIA's manufacturing approach. The 200 Series will now exclusively feature dual-die designs with CoWoS-L packaging, including the GB200 NVL72 and HGX B200 systems. The previously anticipated B200A single-die variant is notably missing. The 300 Series will offer both dual-die and single-die options, but NVIDIA and cloud providers are giving priority to the GB200 NVL72 dual-die system. Starting in Q1 2025, NVIDIA will decrease production of H series, which utilizes CoWoS-S packaging, while increasing production of the 200 Series. This shift indicates a significant decrease in demand for CoWoS-S capacity until 2025.
Although B300 systems using single-die CoWoS-S are set for mass production in 2026, the current focus remains on dual-die CoWoS-L products. TSMC believes that transitioning between Blackwell generations will require minimal process adjustments, as both generations use similar front-end-of-line processes with only back-end-of-line modifications necessary. Supply chain partners heavily reliant on CoWoS-S production are experiencing a significant impact, as seen in recent stock price adjustments. However, NVIDIA asserts that this change reflects an evolution in product strategy rather than a weakness in market demand. TSMC is expanding CoWoS-R capacity while slowing down CoWoS-S expansion, recognizing AI and high-performance computing as drivers of sustained growth despite the shifts in packaging technology.
