Element Six (E6), a leader in the development of synthetic diamond advanced material solutions, is set to introduce a groundbreaking Cu-diamond product at Photonics West 2025. Cu-Diamond is a composite material consisting of copper plated diamond, known for its exceptional thermal and electrical conductivity. This innovative solution is designed to tackle the growing thermal management challenges faced by advanced semiconductor devices, providing improved performance and reliability for applications such as Artificial Intelligence (AI), high-performance computing (HPC), and GaN RF devices.
With the increasing size and power of semiconductor devices, managing heat dissipation has become a major concern for the industry. Over 50 percent of electronic device failures are heat-related, and data centers, which currently account for 3.7 percent of total U.S. power demand, are projected to reach 10 percent by 2029. Therefore, innovation in thermal management is crucial for achieving next-generation performance and energy efficiency.
"Thermal management remains a significant challenge for semiconductor devices as power levels rise and packaging technologies advance," said Daniel Twitchen, Chief Technologist at E6. "Our copper diamond composite offers a scalable and cost-effective solution for next-generation AI and HPC devices, addressing these challenges and empowering our customers to enhance performance and reliability while reducing cooling expenses."
The new copper diamond composite from E6 boasts exceptional thermal conductivity in the range of 800 W/mK, tailored for high-demand applications. It delivers superior performance at a lower cost, facilitating widespread adoption and enabling integration into various 2.5/3D advanced packaging configurations.
"By leveraging the unmatched thermal conductivity and durability of diamond-based composites, we are ushering in a new era of high-performance devices, not only addressing current challenges but also paving the way for future advancements," Twitchen added.
Advantages:
- Reduces thermal management bottlenecks
- Improves thermal performance of the device package
- Increases device reliability
- Enhances output power
- Maintains performance and structural integrity after thermal cycle testing
- TC and CTE can be tuned by varying the copper-diamond composition
Availability: Cu-Diamond is available in sizes ranging from a few mm to several cm and can be coated with thin metal layers like Au and Ni for compatibility with standard die attach bonding. Custom shapes and features, such as holes, steps, and curves, can be produced based on customer requirements.
Element Six will be showcasing this innovative copper diamond composite at Booth #5110 during Photonics West 2025, offering live demonstrations and expert insights.

