GIGABYTE unveiled its STEALTH series motherboard design during last year's Computex event. TechPowerUp staff got a close look at a sample model of the B650E AORUS STEALTH ICE. The Taiwanese company was preparing to release new board SKUs with backside connectors for power and I/O to compete with similar products from other companies. The initial wave of STEALTH boards did not include any options based on the AMD X670 chipset, but a recent ECC filing suggests that X870-based models may be on the way. A recent investigation by harukaze5719 uncovered multiple registrations for X870 and B850 boards, including two unannounced STEALTH ICE models.
The X870 and B850 AORUS STEALTH ICE models are expected to be released in the next few months, featuring the familiar white design seen on GIGABYTE's current models. Industry insiders believe that a high-end X870E-based model may not be released, as the STEALTH series targets a niche market segment. According to a leak from China, B850 models may be available in ATX and microATX form factors. Higher up in the product lineup, the X870 AORUS STEALTH series is said to offer PCIe 5.0 and DDR5 overclocking support as standard, with the flagship model featuring dual Thunderbolt 4 interfaces. GIGABYTE's back-connected X870 and B850 board designs are expected to come with high price tags, with the current B650E AORUS STEALTH ICE model selling for $320+ in some regions.
