Earlier this year, there were reports of TSMC leading the way in the production of advanced 2 nm (N2) silicon chips. The top foundry company in Taiwan is said to be preparing its Baoshan and Kaohsiung plants for full-scale manufacturing of next-generation chips. Recent insider information indicates that TSMC is making significant progress on the 2 nm (N2) front, with engineers moving into an intensive trial production phase.
The Taiwan Economic Daily News has reported on industry projections, suggesting that the Hsinchu Baoshan facility currently has a monthly production capacity of 5000 to 10,000 2 nm wafers. The Kaohsiung site, specializing in 2 nm chips, has reportedly entered a small-scale evaluation phase.
While TSMC has not commented on leaked data, they have stated that their 2 nm process technology is advancing well and is on track for mass production in the second half of this year. The Baoshan plant could potentially produce up to 25,000 2 nm wafers per month once it reaches mass production. When combined with the estimated output from the Kaohsiung site, insiders believe the total production could reach 50,000 units per month. With a successful transition to the second phase, TSMC's advanced facilities may be able to produce 80,000 2 nm parts by the end of 2025.
Industry experts predict that Apple will be the first to have access to TSMC's cutting-edge products.
