Qualcomm Showcases Advanced Packaging with Snapdragon X2E Series

At the recent Snapdragon Summit in Hawaii, Qualcomm unveiled its latest advancements in chip packaging and memory integration, signaling a significant leap in high-performance computing. Photos from the event, shared by ComputerBase, reveal the company’s commitment to pushing the boundaries of both silicon and packaging technology with the new Snapdragon X2E series.

Innovative On-Package Memory for AI and Media Workloads

The flagship model, the Snapdragon X2E-96-100, stands out with its innovative use of on-package LPDDR5X memory. This 18-core processor features memory arrays stacked directly on the chip, surrounding an Oryon 3 cluster. This design minimizes latency and maximizes sustained throughput, making it ideal for demanding AI and media applications. The on-package memory configuration supports between 48 GB and over 128 GB of LPDDR5X across 12 channels, delivering an impressive 228 GB/s of bandwidth.

The X2E-96-100 is engineered for peak performance, with CPU clock speeds reaching up to 4.6 GHz and a two-core boost mode that hits 5.0 GHz. The integrated GPU operates at up to 1.85 GHz, ensuring robust graphics and compute capabilities for intensive workloads.

Three Distinct Snapdragon X2E Configurations

Qualcomm is offering three main configurations in the X2E lineup, each tailored to different performance and power requirements:

  • X2E-96-100 (Extreme SiP): 18 cores, 12-channel on-package LPDDR5X memory (48–128 GB+), 228 GB/s bandwidth, CPU up to 5.0 GHz (boost), GPU up to 1.85 GHz.
  • X2E-88-100: 18 cores, off-package 8-channel memory (152 GB/s), base CPU clocks near 4.0 GHz, two-core turbo up to 4.7 GHz.
  • X2E-80-100: 12 cores, off-package 8-channel memory (152 GB/s), 4.0 GHz baseline, single-core and dual-core bursts up to 4.7 GHz and 4.4 GHz, respectively.

Cutting-Edge Features and Connectivity

All Snapdragon X2E chips are manufactured on TSMC’s advanced 3 nm process node, ensuring high efficiency and performance. The platform supports up to 12 PCIe Gen 5 lanes, dual PCIe 5.0 lanes for NVMe storage, USB4, and three USB-C ports. Wireless connectivity is equally advanced, with integrated Wi-Fi 7 and Bluetooth 5.4.

For imaging and video, the X2E series includes a Spectra ISP and an Adreno VPU, enabling multi-8K encode and decode capabilities as well as simultaneous 8K workflows. These features position the Snapdragon X2E lineup as a powerful solution for next-generation AI, media, and high-performance computing applications.