Congatec Unveils New Computer-on-Modules Powered by Intel Core Ultra Series 3

Congatec has expanded its portfolio with the introduction of five new Computer-on-Modules (COMs) featuring the latest Intel Core Ultra Series 3 processors, codenamed "Panther Lake-H." These modules are engineered to deliver a significant leap in embedded computing and edge AI performance, targeting applications that demand high efficiency and advanced AI capabilities.

Advanced AI Performance for Embedded Systems

The new modules are designed to meet the growing requirements of AI-driven workloads at the edge. The top-tier configurations can achieve up to 180 TOPS (Tera Operations Per Second) of AI performance, a milestone made possible by Intel’s flagship Core Ultra X9 388H APU. This level of processing power enables developers to deploy sophisticated AI models without the need for additional discrete accelerators, streamlining system design and reducing overall complexity.

Flexible Form Factors and Memory Options

Congatec’s Panther Lake-H lineup is available in multiple form factors, including COM-HPC and COM Express modules, to accommodate a wide range of embedded applications:

  • MC1000 (COM Express Type 10): This compact, credit card-sized module (55 x 84 mm) supports up to 32 GB of LPDDR5X memory, soldered directly onto the board, with speeds up to 8533 MT/s.
  • HPC/mPTL (COM-HPC mini): Optimized for SWaP-C (Size, Weight, Power, and Cost), this 95 x 70 mm module offers up to 96 GB of soldered LPDDR5X memory, also reaching 8533 MT/s.
  • TC1000 and TC1000r (COM Express Compact): Both models share a 95 x 95 mm footprint. The TC1000 features dual SODIMM sockets supporting up to 128 GB of DDR5 memory at 7200 MT/s, while the TC1000r is equipped with 96 GB of LPCAMM2 memory based on LPDDR5X, achieving speeds up to 8533 MT/s.
  • HPC/cPTL (COM-HPC Client Size A): The largest module in the series (95 x 120 mm) includes an LPCAMM2 socket for up to 96 GB of LPDDR5X memory, with transfer rates up to 7466 MT/s.

Designed for Next-Generation Embedded and Edge AI Applications

These new modules are built to withstand demanding environments and are suitable for a variety of industrial, medical, and edge computing applications. The ruggedized designs and broad memory configurations provide flexibility for system integrators and developers looking to upgrade their solutions with the latest Intel Core Ultra Series 3 technology.

While Congatec has yet to release a comprehensive press statement, detailed product specifications and configuration options are available on the company’s website. The new Panther Lake-H modules represent a significant advancement in embedded computing, offering high-performance AI capabilities in versatile, compact form factors.