Duronaut Pro and Hydronaut Pro: Advancements in Thermal Paste Technology

Thermal Grizzly has introduced two advanced thermal pastes—Duronaut Pro and Hydronaut Pro—designed to deliver superior thermal conductivity compared to their standard counterparts. While both products maintain the core requirements of their predecessors, they bring targeted improvements for specific use cases, making them ideal for high-performance and industrial applications.

Enhanced Thermal Conductivity: Why It Matters

Although laboratory tests reveal only marginal temperature differences between the Pro and non-Pro variants, these improvements are significant given the limited scope for further advancements in thermal paste technology. Even small gains in thermal conductivity can have a meaningful impact on system performance and reliability, especially in demanding environments.

Thermal conductivity is best evaluated by measuring the temperature difference (delta Kelvin) between the heat source and the cooler under controlled conditions. For example, with a 30 x 30 mm contact surface and a 240-watt heat flow, a lower temperature delta indicates better thermal conductivity. This method, which also accounts for contact pressure (300 N force or 48 PSI), provides a more accurate comparison than simply stating conductivity in watts per meter and Kelvin (W/(m × K)).

Duronaut Pro: Engineered for Long-Term Stability

Duronaut Pro is a premium thermal paste developed with a focus on both enhanced thermal conductivity and exceptional long-term stability. The name "Duronaut" reflects its emphasis on durability. This stability is achieved through a specially formulated silicone oil combined with a blend of aluminium micropowder and zinc oxide nanopowder, each optimized for particle shape and size.

The advanced particle engineering minimizes the pump-out effect—a common issue where thermal paste is displaced from the contact zone due to thermal cycling and micro-movements. Duronaut Pro’s formulation ensures excellent adhesion and allows for ultra-thin application layers, resulting in extremely low thermal contact resistance and efficient heat transfer between components such as CPUs and coolers.

  • Extreme long-term stability
  • Excellent thermal conductivity
  • Electrically non-conductive
  • No curing required

Hydronaut Pro: Optimized for Industrial Applications

Hydronaut Pro stands out for its silicone-free carrier structure, making it particularly suitable for industrial systems. Traditional thermal pastes often use silicone-based oils, which can bleed or migrate under thermal stress, especially during temperature fluctuations. This can lead to the pump-out effect, where the paste is displaced from the contact surface, potentially compromising thermal performance.

While this is generally not a concern in standard PC use, in industrial environments, silicone oil migration can be problematic—especially if it interacts with sensitive materials or seals such as EPDM or NBR, potentially causing swelling or material degradation. Hydronaut Pro addresses these challenges by eliminating silicone from its formulation, ensuring compatibility with a wider range of materials and maintaining stable performance under demanding conditions. The product is RoHS-compliant and designed for easy application, meeting the needs of both industrial and high-performance users.

  • Suitable for industrial applications
  • Outstanding thermal conductivity
  • Silicone-free formulation
  • Electrically non-conductive
  • No curing required