News & Articles

AMD has relaunched the Ryzen 7 5800X3D as a 10th Anniversary Edition with special packaging and a Carbice Ice Pad, touting it as the fastest DDR4 gaming CPU, and also introduced the new Ryzen 7 7700X3D with Zen 4 architecture and 3D V-Cache, both targeting gamers with competitive pricing.

NVIDIA has unveiled the RTX Spark, a groundbreaking consumer PC processor designed to revolutionize the Windows AI PC market with powerful local AI capabilities, advanced gaming performance, and deep software ecosystem support—directly challenging Apple and AMD with its Arm-based architecture, GeForce RTX "Blackwell" graphics, and seamless integration with Windows 11 Copilot+ devices.

ASRock has unveiled updated fanless iBox mini PCs for industrial use, now featuring Intel Core Ultra X7 358H or Ultra 5 325 CPUs, support for up to 128 GB DDR5 RAM with in-band ECC, robust aluminum chassis, and a wide array of high-speed connectivity options.

Annotated die-shots of Samsung’s new Exynos 2600 reveal a cutting-edge 2 nm monolithic chip featuring a powerful 10-core CPU, AMD RDNA 4-based Xclipse 960 GPU, and a next-gen NPU—all packed with massive on-die memory and advanced I/O, promising a leap in performance for smartphones, tablets, and ultraportable notebooks.

French PC maker Bleu Jour has refreshed its compact, passively cooled Kubb Fanless mini PC with Intel’s new Core Ultra X7 358H “Panther Lake” CPU and Arc B390 graphics, but the upgraded performance and premium aluminum chassis now start at €1,850—well into high-end territory for mini PCs.

Phoronix’s exclusive benchmarks of NVIDIA’s new 88-core Arm-based "Vera" CPU reveal it outperforms the latest Intel Xeon and AMD EPYC chips in key data center workloads, signaling NVIDIA’s rapid ascent as a major force in the server CPU market.

AMD is reportedly planning to manufacture its next-generation "Zen 7" CPUs—codenamed "Grimlock"—on TSMC's advanced A14 angstrom-era node, introducing major AI-focused features, new instruction sets like AVX10 and ACE, enhanced security, and exploring innovative packaging technologies such as Powertech's FOPLP for its future EPYC server processors.

Researchers at Fraunhofer IPMS, as part of the European APECS pilot line, have achieved a major breakthrough in chip manufacturing by seamlessly embedding chiplets into silicon pockets, paving the way for quasi-monolithic integration that combines the compactness of single chips with the flexibility of modular systems—promising higher performance, reliability, and scalability for next-generation microelectronics.

AMD has unveiled the Ryzen AI Halo, a $3,999 compact AI development computer powered by the new 16-core "Strix Halo" processor and 128 GB of memory, aiming to outpace Apple’s Mac Mini and NVIDIA’s DGX Spark in AI workloads, with robust Windows support, a comprehensive software suite, and a developer program offering exclusive tools and resources.

At the J.P. Morgan TMT Conference, Intel CEO Lip-Bu Tan unveiled an ambitious roadmap for the company’s next-generation 14A node—set for risk production in 2028 and high-volume manufacturing in 2029—highlighting its use of cutting-edge High-NA EUV technology, direct competition with TSMC’s A14, and the addition of future 10A and 7A nodes to secure Intel’s position as a long-term foundry partner for global customers.